BGA 9000A is a vision-based rework, removal, and placement assembly that uses the combined technologies of a IR tool, a desoldering tool, an optimizer and a preheater to create a complete system that handles even the most demanding rework activity.
- Microprocessor controlled with full digital display of time, temperature for maximum performance.
- Innovative X Y axis adjustment method that simplifies the complex steps of focusing/positioning the BGA in the PCB.
- Uses split vision technology.
- Equipped with high precision optimizer that has dependable accuracy.
- Precision solder. Lessen the distortion of PCB due to heat. Probability of repair repetition is lower.
- Uses infrared heat wave technology instead of the conventional hot air, effectively solves the major problem being encountered when using the hot air gun, which is the movement of surrounding components while reworking.
- Designed for both lead-free and standard solders.
- Versatile PCB holder that has board capacity of up to 280 X 430mm.
MAIN UNIT | PRE-HEATER |
| Power Input: | 220V / 110V | Power Consumption: | 500W |
| Frequency: | 50 ～60 Hz | Temperature: | 100～350°C |
| Dimension: | 530 x 480x 550mm | Heating Element : | Quartz Infrared |
| Weight: | 48kgs. | Output Voltage: | 220V / 110V |
SOLDERING IRON | INFRARED SOLDERLIGHT TOOL |
| Power Consumption: | 75W | Power Consumption: | 150W |
| Temperature: | 200～480°C | Temperature: | 200～480°C |
| Heating Element : | Ceramic Heater | Heating Element : | Halogen Light Source |
| Output Voltage: | 24V | Output Voltage: | 15V |
